"Krystal Bond™ Technology is an advanced process in which inorganic materials are molecularly diffused onto a metallic surface in the presence of certain gases. A diffusion takes place at a sufficiently high temperature that is far below the melting point of the metal. As the process occurs, the bonding material flows while assuring that the high yield strength properties of the metal are preserved.
As the temperature is reduced, the bonding material solidifies and secures the silicon strain gauge in position. This process provides a high electrical isolation with low leakage rates at 500VAC, making this technology ideal for process control applications. Operating at low strain levels, AST’s specially grown and micro-machined silicon strain gauges yield a high output with low thermal errors. Krystal Bond™ Technology enhances one of the MEMS-technologies currently offered by AST."
- Karmjit S. Sidhu
Vice President Sales & Marketing
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